Technology
From mid/low-voltage shielded-gate and trench, to high-voltage superjunction and IGBT, to CSP and smart power stages — a complete platform matrix for power-system design in consumer, compute, and energy.
Split-Gate Trench
A shield electrode in the trench balances gate charge and on-resistance for efficient mid/low-voltage conversion and high-current switching.
Trench-gate platform
A mature trench-gate process family with complete voltage and polarity coverage and a wide package set — the workhorse platform for conversion, load switches, and general power stages.
High-voltage superjunction
Charge-balanced superjunction structures serve high-voltage switching with lower on-resistance in a given die area, for PFC, resonant, and energy-conversion paths.
Field-stop trench
A field-stop trench IGBT platform balancing VCE(sat) and switching for VFD, UPS, charging, and other mid/high-voltage, high-current uses.
Wafer-level package
CSP / WLCSP dual-N common-drain structures serve portable battery protection and charge/discharge paths at near-die board area for space-critical designs.
Smart power stage
Driver and high-/low-side MOSFETs in one package raise power density and simplify multiphase layout for motherboard, server, and other high-current core rails and system power management.